Name: Multi-Wire-Diamant-Sägesystem für SiC/Saphir/ultraharte spröde Materialien
Uploaded: 2026-02-06CST00:12:12-06:00
Duration: 17 s
Description: Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

Plaudern Kontaktieren Sie uns

Multi-Wire-Diamant-Sägesystem für SiC/Saphir/ultraharte spröde Materialien

Andere Videos

August 18, 2025

Keyword: wissenschaftliche Laborausrüstung

Plaudern Kontaktieren Sie uns

Tags:

#UVbeförderungsmeter #Helles Beförderungs-Meter #Meter des hellen Getriebes

Video Description:

Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.

In Verbindung stehende Videos