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4 inch 3C-N Type 3C-SiC Silicon Carbide Wafers MPD or Dummy Grade

4 inch 3C-N Type 3C-SiC Silicon Carbide Wafers MPD or Dummy Grade

Markenbezeichnung: ZMSH
Modellnummer: 3C-N SiC-Wafer
MOQ: 10pieces
Verpackungsdetails: Mehrfachwafer-Kassette oder Einfachwaferbehälter
Zahlungsbedingungen: T/t
Ausführliche Information
Herkunftsort:
CHINA
Zertifizierung:
RoHS
Durchmesser:
4 Zoll, 99,5 mm ~ 100,0 mm
Dicke:
350 μm±25 μm
Typ:
3C-N SiC-Wafer
Rauheit:
Polnisch Ra≤1 nm
Kette:
≤40 μm
Grad:
MPD oder Dummy Grade
Hervorheben:

3C-SiC silicon carbide wafers

,

4 inch silicon carbide wafer

,

MPD grade SiC wafers

Produkt-Beschreibung
4 inch 3C-N Type 3C-SiC Silicon Carbide Wafers MPD or Dummy Grade
Product Overview

The 4 inch 3C-N Type 3C-SiC Silicon Carbide Wafers offer superior performance characteristics for advanced semiconductor applications.

Introduction of 3C SiC Wafer

Cubic silicon carbide (3C-SiC) exhibits better carrier mobility, thermal conductivity, and mechanical properties compared to 4H-SiC. With lower defect density at the oxide gate interface, 3C-SiC enables manufacturing of high-voltage, reliable, and long-life devices. While typically prepared on Si substrates, bulk 3C-SiC wafers present a cost-effective solution for power devices in the 600V-1200V range.


             4 inch 3C-N Type 3C-SiC Silicon Carbide Wafers MPD or Dummy Grade 0

Advantages of 3C-N SiC Wafer
  • Excellent Electrical Properties: Moderate bandgap (~2.36 eV) enables high breakdown voltage and low leakage current. High electron mobility allows faster switching speeds and lower conduction losses.
  • Superior Thermal Performance: High thermal conductivity (~3.2 W/cm*K) ensures efficient heat dissipation. Maintains stability at temperatures exceeding 350°C.
  • Mechanical Robustness: High hardness and chemical stability make it suitable for harsh environments.
Specifications
Parameter Zero MPD Standard Production (P Grade) Dummy Grade (D Grade)
Diameter 99.5 mm~100.0 mm
Thickness (4H-N) 350 μm±15 μm 350 μm±25 μm -
Thickness (4H-SI) 500 μm±15 μm 500 μm±25 μm -
Wafer Orientation Off axis: 4.0° toward <1120> ±0.5° for 4H-N
On axis: <0001>±0.5° for 4H-SI
Micropipe Density (4H-N) ≤0.2 cm-2 ≤2 cm-2 ≤15 cm-2
Micropipe Density (4H-SI) ≤1 cm-2 ≤5 cm-2 ≤15 cm-2
Resistivity (4H-N) 0.015~0.024 Ω*cm 0.015~0.028 Ω*cm -
Resistivity (4H-SI) ≥1E10 Ω*cm ≥1E5 Ω*cm -
Primary Flat Orientation {10-10} ±5.0°
Primary Flat Length 32.5 mm ± 2.0 mm
Secondary Flat Length 18.0 mm ± 2.0 mm
Edge Exclusion 3 mm
LTV/TTV/Bow/Warp ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm -
Material Comparison
  • 4H-SiC: High electron mobility and low conduction resistance make it ideal for power electronic devices.
  • 6H-SiC: Stable structure and excellent luminescence performance suit optoelectronic applications.
  • 3C-SiC: High saturation electron velocity and exceptional thermal conductivity make it perfect for high-frequency and high-power devices.
4 inch 3C-N Type 3C-SiC Silicon Carbide Wafers MPD or Dummy Grade 1
Frequently Asked Questions
What is a SiC wafer?

A SiC wafer is a single-crystal substrate made from silicon and carbon atoms. As a wide-bandgap semiconductor material, it's used in next-generation power electronics, RF devices, and high-temperature applications. Its superior properties enable smaller, faster, and more energy-efficient electronic devices for electric vehicles, renewable energy systems, and advanced communication technologies.

What is the full form of 3C-SiC?

3C-SiC (Cubic Silicon Carbide) is a cubic crystal form of silicon carbide characterized by high electron mobility, excellent thermal stability, and compatibility with silicon substrates. It's widely used for high-speed, low-power, and cost-effective semiconductor devices.

Which is better, SiC or GaN?

SiC (Silicon Carbide) excels in high-power, high-voltage, high-temperature applications such as electric vehicles and renewable energy systems. GaN (Gallium Nitride) performs better in high-frequency, low-to-medium voltage applications like fast chargers and 5G systems.